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CAPABILITIES

My skills include the following.

The patterning, modeling, prototyping, and characterization techniques listed below are all things I have multiple experiences with.

Also, I have rudimentary proficiency in computer languages and illustration programs.

Patterning

  • Microscale Patterning using Maskless-lithography (AZ5214E Photoresist)

Prototyping

  • Thermal & E-Beam Evaporation

  • Atomic Layer Deposition

  • DC & RF Sputtering

  • 2D Material Transfer

  • Dip Coating

  • Metal 3D Printing using Selective Laser Melting (SLM) process

  • Polymer 3D Printing (ABS, PLA)

  • Wet Etching

  • Reactive Ion Etching (RIE)

  • Oxygen Plasma Ashing

  • Mechanical Polishing & Grinding

  • Box & Tube Furnace Annealing

Computer Language

  • C

  • MATLAB

  • Python

  • A little JAVA and Linux commands

Modeling

  • Lumerical Software (FDTD)

  • COMSOL Multiphysics

Characterization Techniques

  • Optical Microscopy (OM)

  • Dark-Field Microscopy

  • Scanning Electron Microscopy (SEM) including Back-Scattered Electron (BSE) detector

  • Energy Dispersive Spectroscopy (EDS)

  • High-Resolution Transmission Electron Microscopy (HR-TEM)

  • UV-Vis Spectroscopy

  • X-Ray Diffraction (XRD) Spectroscopy

  • Probe Station

  • Ellipsometry

  • Alpha Step

  • Vickers Hardness Tester

  • Compression Testing Machine

Illustration

  • Rhinoceros

  • Sketchup

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